AG-TERMOPASTY (258)
Silicone encapsulating compound | white | 110g | -50÷200°C | 20kV/mm
Silicone encapsulating compound | grey | 110g | -50÷200°C | 20kV/mm
Silicone encapsulating compound | transparent | 108g | -50÷200°C
Flux: rosin based | RMA | gel | syringe | 14ml | SMD soldering
Solder paste | lead-based | 179°C | Sn62Pb36Ag2 | 20g | syringe | 5ml
Silicone encapsulating compound | white | -50÷180°C | 1.2g/cm3
Heat transfer paste | silicon based | 100g | PASTA HPX | 2.8W/mK
Paste | Sn96,5Ag3Cu0,5 | lead free | syringe | 25÷45um | 20g | 217°C | 15%
Heat transfer paste | silicon based | 60g | PASTA HPX | 2.8W/mK
Heat transfer paste | red | on copper basis | copper | 40g | 3.1W/mK
Silicone encapsulating compound | transparent | 100g | -55÷200°C
Oil | colourless | vaseline | liquid | plastic container | 1000ml
Flux: rosin based | halide-free,No Clean,Lead Free | liquid | 0.5l
Flux: rosin-free | halide-free,Lead Free | liquid | bottle | 0.5l
Solder paste | lead-based | 179°C | Sn62Pb36Ag2 | 40g | syringe | 10ml
Paste | Sn96,5Ag3Cu0,5 | lead free | syringe | 25÷45um | 40g | 217°C | 15%
Heat transfer paste | white | silicon based,do not conduct | 400g

