Tip | 420÷475°C | for Thermaltronics DS-KIT-3 desoldering iron
Laminate | CEM3 | 1.5mm | L: 210mm | W: 297mm | Coating: copper
Board: universal | prototyping,solderless | W: 54.5mm | L: 166mm
Protection bag | ESD | L: 152mm | W: 102mm | Thk: 75um | 100pcs | <10GΩ
Shrink nozzle | Kind of nozzle: reduction | Øin: 34mm | Ø: 14mm
Shrink nozzle | Kind of nozzle: reduction | Øin: 34mm | Ø: 9mm
Laminate | FR4 | 2mm | L: 297mm | W: 210mm | Coating: copper | double sided

